Technical Program Committee

Dingde Jiang
University of Electronic Science and Technology of China

Litao Zhang
Zhengzhou University of Aeronautics, China

Lei Shi
Carlow Institute of Technology, Ireland

Sheng Qi
University of Electronic Science and Technology of China, China

Lei Chen
Xuzhou University of Technology, China

Bangtao Zhou
University of Electronic Science and Technology of China, China

Giovanni Stea
University of Pisa, Italy

Lorenzo Donatiello
University of Bologna, Italy

Andrea D’Ambrogio
University of Rome Tor Vergata, Italy

Christian Engelmann
Oak Ridge National Laboratory, Tennessee, USA

Kevin Jin
Illinois Institute of Technology, USA

Gary Tan
National University of Singapore, Singapore

Jiaqi Yan
Microsoft, Washington, USA

James Byrne
Dublin City University, Ireland

Jan Himmelspach
Nordakademie, University of Applied Sciences, Germany

Johannes Lüthi
University of Applied Sciences Kufstein, Austria

Linbo Luo
Xidian University, China

Stephan Eidenbenz
Los Alamos National Laboratory, USA

Yiping Yao
National University of Defense Technology, Changsha, China

Francesco Quaglia
University of Rome Tor Vergata, Italy

Zongwei Luo
Southern University of Science and Technology, China